Four die attach methods – epoxy, eutectic, soft solder and flip chip – serve to attach the semiconductor chip to the package and meet the demanding functionality requirements of today`s advanced semiconductor devices.

In evaluating a die attach process, it is important to understand a number of factors that can impact the process performance and end-product quality.

Surface Mount Technology (SMT) revolutionized the printed circuit board industry by replacing insertion components and wave soldering with smaller, less expensive surface mount components and reflow soldering.  As component size and spacing become increasingly compressed, the need for precise component placement becomes critical.  High speed also is required to drive components per hour (>50K cph) in highly price competitive markets like memory manufacturing.  Small and extremely fast rotary and linear motion axes need precise and reliable position feedback.

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