SEMICONDUCTOR
High Speed Video Cameras for Semiconductor Applications
WIREBONDING
WHEN YOU SLOW THE LINE DOWN, THE ISSUES STOP, BUT WHEN YOU SPEED IT BACK UP, IT IS TOO FAST TO OBSERVE!
During wire bonding, capillary head touches neighboring wire bond. Early detection of this problem prevents part from continuing down the production line chain.
EPOXY
DIE BONDING
HIGH SPEED BONDING DURING CONTACT CAN BE SLOWED DOWN USING HIGH SPEED CAMERA
Highspeed camera check positioning of the very high speed process of miniature gold plated part attachment onto PCB; quality of bonding is assured.
PICK AND PLACE
DURING PICK&PLACE PROCESS OFTEN ISSUE UNDETECTABLE DURING HIGH SPEED
Very high speed SMT pick process is checked using highspeed camera
Popular High Speed Cameras for this Application
IX i-Speed 5
Often Used Frame Rates
5000 - 100,000
Max Resolution at FPS
1920 x 1080 @ 6382fps
Max Frame Rate
1,000,000fps
AOS M-PRI
Often Used Frame Rates
1000 - 10,000
Max Resolution at FPS
1280 x 800 @ 4000fps
Max Frame Rate
83,000fps
FASTEC HS-7
Often Used Frame Rates
2500 - 10,000
Max Resolution at FPS
1920 x 1080 @ 2500fps
Max Frame Rate
12,000fps