SEMICON Engineering - how to analyse high speed component pick and place motion

SEMICON, Electronics and Hard Disk manufacturing

SEMICON, Hard Disk and Electronics manufacturing

Our wide variety of high-speed camera, optics and lighting options are the best solution for

Wire-bonding process - check wire loop pattern, lead frame bounding, early detection of wire necking, etc

SMT Pick and place - how chip is missing during placing, force applied during placing;

DIE Epozy bond process

With highspeed camera, engineer can investigate the amount of pressure and time the nozzle exerts on DIE; qualntity of epozy fillet is analysed.
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Component placing and bonding

Highspeed camera check positioning of the very high speed process of miniature gold plated part attachment onto PCB; quality of bonding is assured.
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Wire Bonding process

Wire Bond capillary touches neighbouring wire bond. Problem is detected with highspeed camera
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SMT Pick process

Very high speed SMT pick process is checked with highspeed camera
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Wire Bonding - defect process

During wire bonding, capillary head touches neighbouring wire bond. Early detection of this problem prevents part from continuing down the production line chain.
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